The PCBA processing process is quite cumbersome and involves many complex processes. However, during the processing, it is inevitable that some defects may occur in the product due to personnel negligence or machine failures. Due to the many process processes, there may also be many defects during the process. Next, let's take a look at the common defects encountered in PCBA processing.
Firstly, there is the issue of welding. As a very important part of the PCBA processing process, the welding process is also prone to defects. Both reflow soldering and wave soldering processes can cause common welding defects such as short circuits, false soldering in empty solder joints, and lack of tin at the solder tips. Among them, if there is too close distance between solder joints or incorrect welding direction during welding Excessive speed and other phenomena can lead to the occurrence of short circuits. If the parts are not welded together with the board, we call it the phenomenon of empty soldering. If the welding cutting of the parts is not clean, or if the solderability is poor or the glue is not properly applied, it may lead to the occurrence of empty soldering;
In addition to welding issues, PCBA processing can also encounter adverse phenomena such as open circuit, warping, deviation, and missing parts. If the circuit is not connected, it will lead to open circuit. However, if there is deviation during machine installation or if the temperature rises too fast during the preheating stage of reflow soldering, it will lead to warping; The phenomenon of deviation is often caused by unclear positioning of the board. If a component that should have been installed is not installed, we call it a missing component;
The above is a summary of common defects in PCBA processing. Of course, there are also some common defects such as damage, overflow, side standing, and component deformation. From the above description, we can know that most common defects are related to the welding process, which means that if there are abnormalities during reflow and wave soldering, it will lead to the occurrence of various defects. Therefore, In order to prevent the occurrence of adverse phenomena, we should always maintain focus during PCBA processing and production, especially during the welding process.
