In the blue ocean of electronic manufacturing in the 21st century, the requirements for craftsmanship are constantly improving, and the requirements for quality are also demanding. Any irresponsibility towards end users may cause irreparable losses to oneself. In the quality requirements of intelligent devices, there are more requirements for circuit boards (pcba), so we have to mention the two major processes of Reflow soldering and wave soldering. What is the difference between Reflow soldering and wave soldering in PCBA processing?
1、 Reflow soldering
Reflow soldering is simply used for SMT chip mounting, abbreviated as SMT chip mounting. It is achieved by first printing solder paste on a PCB pad, and then using a mounting machine to mount the components onto the solder paste printed pad. Then, the solder paste is melted through a reflow soldering furnace, cooled, and solidified. A process of connecting and powering on the soldering end or pin of a component to a PCB pad. It is called Reflow soldering for short.
2、 Wave peak connection process flow
Wave soldering is simply the welding method of plug-in materials, abbreviated as DIP welding. Its process requirement is to insert the plug-in material into the corresponding welding hole first, and then send the circuit board to the pre melted soft solder furnace through the furnace fixture. The melted solder, through the jet of the mechanical pump or the electromagnetic pump, forms the solder wave peak. The plug-in solder joint melts tin paste into the hole through the wave peak. After cooling and solidification, first the plug-in pin is welded with the through hole to achieve electrical performance. Abbreviation: Wave soldering.
