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TMM10 High-frequency Board

TMM10 High-frequency Board

The TMM10 thermosetting high-frequency board microwave RF circuit board material is designed for the needs of high-reliability electroplated through-hole applications for strip lines and microstrip line applications. It is a composite material of carbon-carbon composites and thermosetting...
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Product Introduction

Introducing the TMM10 Thermosetting High-Frequency Board Material, meticulously engineered to meet the stringent requirements of high-reliability electroplated through-hole applications for strip lines and microstrip line applications. Crafted from a sophisticated blend of carbon-carbon composites and thermosetting polymers, TMM10 offers unparalleled performance in the realm of microwave RF circuit board materials.

One of the standout features of TMM10 is its versatility, offering a range of dielectric constants and copper foil types to suit diverse application needs. Unlike traditional PTFE microskin laminates, TMM10 harnesses the combined strengths of ceramics and PTFE, eliminating the need for specialized manufacturing processes. Notably, TMM10 laminates boast an impressively low dielectric constant thermal temperature coefficient, typically less than 30 ppm/°C, ensuring stability even under challenging conditions.

Moreover, TMM10 laminates exhibit isotropic thermal expansion coefficients, closely mirroring those of copper. This attribute translates to high-reliability electroplated through-holes and minimal clock shrinkage values, enhancing overall performance and longevity. Additionally, with double the thermal conductivity of conventional PTFE/ceramic laminates, TMM10 facilitates efficient heat dissipation, crucial for maintaining optimal operating conditions.

Another noteworthy advantage of TMM10 is its exceptional dimensional stability during the heating process, safeguarding against pad detachment or material deformation. Available with electrodeposited copper foil ranging from 1oz to 2oz, TMM10 can be seamlessly bonded to brass or aluminum substrates. With thickness options spanning from 0.015" to 0.500", this material accommodates a wide spectrum of design requirements.

Furthermore, TMM10 exhibits excellent resistance to etchants and solvents commonly used in PCB manufacturing processes, ensuring compatibility with standard fabrication techniques. From its superior thermal properties to its impeccable dimensional stability, TMM10 stands as a testament to cutting-edge innovation in high-frequency board materials. Experience the pinnacle of reliability and performance with TMM10 for your next RF circuit board project.

 

 

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