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2oz Finished Copper PCB

2oz Finished Copper PCB

A 2 oz finished copper PCB is a printed circuit board whose copper weight per square foot amounts to two ounces What's is advantage for 2oz finished copper PCB 2 OZ Copper PCB is superior to 1 OZ Copper PCB; however, the cost of 2 OZ is more than that of 1 OZ, but the performance, current,...
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Product Introduction

A 2 oz finished copper PCB is a printed circuit board whose copper weight per square foot amounts to two ounces

 

What's is advantage for 2oz finished copper PCB

 

2 OZ Copper PCB is superior to 1 OZ Copper PCB; however, the cost of 2 OZ is more than that of 1 OZ, but the performance, current, and thermal management are considerably better. Chargers and adapters, for example.

The normal inner layer copper thickness chosen for the inner layer is 2oz copper (70m thick or 2.8 mils). This is the normal beginning copper thickness for the PCB's outer layer when the finished copper weight is 3 oz.

Flexible PCBs are also starting to employ 2 oz. PCBs in the market, and the most popular copper weights for flexible PCBs are 0.5 oz. and 1 oz., but lesser copper weights are also available.

 

Today, we will first focus on the thick copper plating process of 2oz copper board. Monitoring the process parameters is crucial to prevent unnecessary losses, which can result from both subjective and objective factors. To ensure the success of the thick copper plating process, it's essential to address the following aspects:

 

1. Adjust the area value calculated by the computer, taking into parameters accumulated during actual production, by increasing it by a certain value.

2. To maintain the coating's integrity within the hole, increase the original current value with an impulse current based on the calculated current value, and then promptly revert to the original value.

3. After 5 minutes of electroplating on the circuit board, remove the substrate and inspect whether the copper layer on the surface and inside the hole is complete. Ensure a favorable  and metallic shiny copper in all the holes.

4. Maintain a specific distance between substrates.

5. Upon reaching the required plating time for thickening copper, maintain a certain current level during substrate removal. This is done to prevent any blackening or darkening on the surface of subsequent substrates and inside the holes.

 

Below board is used for medical ozone treatment instrument, which is an instrument for making and degrading ozone gas (O3)

 

BSI´s PCB Features BSI´s technical spec
Number of layers 8 layers
Technology highlights Laser Drilling
Materials Low loss / low Dk, higher performance FR-4
Dielectric thickness 2.0mm
Copper weights (finished) 2 ounce
Minimum track and gaps 0.12mm / 0.12mm
core thickness 1.8mm post bonded
Surface finishes available ENIG+OSP

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