Two-depth Cavity Printed Circuit Boards

Two-depth cavity printed circuit boards are suitable for special package similar to package on Abstract package (PoP) , which can increase package density to decrease the cubage of electronic products andreplace wire bonding theoretically. This report developed the two-depth printed circuit board based on filleipiece to impede resin flow of prepregs. The technical process can not only improve the quality performance but also satisfy various stack-up of PCB, which benefits the popularization of its application.

Two-depth Cavity Printed Circuit Boards, as one of the key processes in electronic product manufacturing, packaging technology has "four levels," which are Chip-level interconnection one by one (Zero-level power direction development), Second-level packaging (PWB or card) and Third-level packaging (motherboard). Two-depth cavity printed circuit boards is just  one of them.

The first level, also known as chip-level packaging, refers to the process of pasting and solid sealing integrated circuit chips between the packaging substrate or pin frame, creating easy-to-handle and transportable packages that can be connected to the next level of assembly.

The second level involves the process of combining several first-level completed packages with other electronic components to create an electronic card.

The third level is the process of assembling several second-level completed cards onto a main circuit board, making it a component or subsystem.

The fourth level is the process of assembling several subsystems into a complete electronic product.

Two-depth cavity printed circuit boards refer to the second level of package, which is commonly known as "package on package" (PoP) technology

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