Two Depth Cavity P Circuit Board(POP Board)

At BS Interconn, we deliver innovation through our Two-Depth Cavity Printed Circuit Boards, engineered specifically for Package-on-Package (PoP board) applications. The state-of-the-art PCB technology provides improved packaging density, reduced device volume, and theoretically provides a replacement for conventional wire bonding. The invention is in its dual-step cavity structure, built with exact lamination and filler control technology, which prevents the resin flow when the prepreg is pressed. It ensures that there is no defect developed in the cavity depths, which enhances better thermal performance, mechanical strength, and interconnect reliability.

🛠️ Comprehensive Manufacturing Process:

The production of our two-depth cavity PCBs is based on multi-step lamination and precision filler technology to control resin flow and cavity depth. Such a process comprises:

board 1: Inner layer image transfer → Lamination → Drilling → PTH → Via filling → Outer image transfer → Spacer pad processing

Prepreg prep: opening design for first and second cavity levels

board 2: Inner image transfer → Lamination → Drilling → PTH → Via filling → Image transfer → Bottom solder mask → Spacer pad

board 3: Inner image transfer → Lamination → Drilling → PTH → Via filling → Image transfer → Cavity bottom solder mask

This multi-board method enables cavity lay-up to be formed to house embedding components or stack packages.

🧪 Material Selection:

High-Tg laminate guarantees durability to different thermal cycles.

Spacer pads are manufactured of high-temperature resistant material, which can also be released easily on semi-cured prepregs.

High temperature performance and deep cavity compatibility are being tested on solder mask ink.

💡 Why Choose BS Interconn for two-depth cavity PCBs?

Filler layers to have accurate control of resin flows

Non-collapsing and non-delamination stable depth of cavity

Increased thermal dissipation, signal integrity, and mechanical reliability

Collaboration with diverse stack-up setups

The Two-Depth Cavity board is used in miniaturization applications (mostly mobile, 5G module, automotive ECU, and IoT wearables)

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