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Impedance Controlling in PCB
The need to regulate the impedance of the circuit board's traces is known as impedance control in PCB. In order to ensure distortion-free signal transmission, interference control is used to maintain the "resistance "that a signal encounters as it travels between a specific layer and its reference layer on the circuit board, within a specific range. Impedance control essentially aims to achieve impedance matching, wherein each system component has a different impedance value.
PCBs require impedance management because high-speed digital and high-frequency analog signals are extremely sensitive to impedance variations throughout the signal path. A circuit's resistance to alternating current flow determines its resistance, and variations in impedance can result in signal reflection, distortion, and attenuation. These effects can include lower system performance, data loss, and signal degradation.
The main factors for impedance Controlling in PCB that affect impedance are as follows:
Trace width (w): Increasing the width reduces the impedance.
Trace spacing (s): Increasing the spacing increases the impedance.
Copper thickness (t): Increasing the thickness reduces the impedance.
Dielectric thickness (h): The greater the thickness, the higher the impedance.
Dielectric constant (Dk): A higher dielectric constant leads to lower impedance.
Note: Solder mask also affects impedance during produce process, but since it is applied on the dielectric, it increases the dielectric constant. This effect is attributed to the influence of the dielectric constant, resulting in a decrease in impedance by approximately 4%.
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BSI´s PCB Features |
BSI´s technical spec |
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Number of layers |
6 layers |
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Technology highlights |
Controlled impedance, 50+/-5ohm |
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Materials |
Low loss / low Dk, higher performance FR-4(EM-528K) |
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Dielectric thickness |
1.2mm |
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Copper weights (finished) |
2.0 ounce |
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Minimum track and gaps |
0.12mm / 0.12mm |
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core thickness |
1.5mm post bonded |
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Surface finishes available |
ENIG+hard gold plating |
PCB designers must carefully regulate impedance along the signal route to ensure signal integrity and dependable transmission. This includes calculating and maintaining transmission line characteristic impedance, guaranteeing consistent dielectric material qualities, managing trace width and spacing, and minimizing signal path length and vias. To minimize noise and interference, impedance regulating also entails selecting acceptable termination methods and creating proper grounding and power planes. Overall, impedance controlling management is critical for designing high-speed, high-frequency, and high-performance PCBs.
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