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Impedance Controlling in PCB

Impedance Controlling in PCB

Impedance control in PCB refers to the need to control the impedance of the traces on the circuit board. Impedance control is the practice of maintaining the "resistance" encountered by a signal as it is transmitted between a particular layer and its reference layer within the circuit board, within a specified range, to ensure distortion-free signal transmission.
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Product Introduction

The need to regulate the impedance of the circuit board's traces is known as impedance control in PCB. In order to ensure distortion-free signal transmission, interference control is used to maintain the "resistance "that a signal encounters as it travels between a specific layer and its reference layer on the circuit board, within a specific range. Impedance control essentially aims to achieve impedance matching, wherein each system component has a different impedance value.

 

PCBs require impedance management because high-speed digital and high-frequency analog signals are extremely sensitive to impedance variations throughout the signal path. A circuit's resistance to alternating current flow determines its resistance, and variations in impedance can result in signal reflection, distortion, and attenuation. These effects can include lower system performance, data loss, and signal degradation.

 

The main factors for impedance Controlling in PCB that affect impedance are as follows:

Trace width (w): Increasing the width reduces the impedance.

Trace spacing (s): Increasing the spacing increases the impedance.

Copper thickness (t): Increasing the thickness reduces the impedance.

Dielectric thickness (h): The greater the thickness, the higher the impedance.

Dielectric constant (Dk): A higher dielectric constant leads to lower impedance.

Note: Solder mask also affects impedance during produce process, but since it is applied on the dielectric, it increases the dielectric constant. This effect is attributed to the influence of the dielectric constant, resulting in a decrease in impedance by approximately 4%.

 

BSI´s PCB Features

BSI´s technical spec

Number of layers

6 layers

Technology highlights

Controlled impedance, 50+/-5ohm

Materials

Low loss / low Dk, higher performance FR-4(EM-528K)

Dielectric thickness

1.2mm

Copper weights (finished)

2.0 ounce

Minimum track and gaps

0.12mm / 0.12mm

core thickness

1.5mm post bonded

Surface finishes available

ENIG+hard gold plating

 

 

PCB designers must carefully regulate impedance along the signal route to ensure signal integrity and dependable transmission. This includes calculating and maintaining transmission line characteristic impedance, guaranteeing consistent dielectric material qualities, managing trace width and spacing, and minimizing signal path length and vias. To minimize noise and interference, impedance regulating also entails selecting acceptable termination methods and creating proper grounding and power planes. Overall, impedance controlling management is critical for designing high-speed, high-frequency, and high-performance PCBs.

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