Stepped Hole On PCB

As a stepped hole PCB for high-speed signal transmission and a platform linking communication between different modules of the electronic system, the production of high-speed PCB boards is increasing year by year. With the increase of clock frequency, transmission line effects that were ignored in traditional low-speed circuit design have become a key factor affecting system performance in high-speed circuit design. Moreover, in order to pursue low power consumption, chip voltages continue to decrease, and the system's noise tolerance decreases, so the adverse consequences caused by signal integrity problems such as crosstalk and radiation are becoming more and more serious. In recent years, with the increasing system clock frequency and circuit integration, the signal integrity problems caused by PCB boards have been widely concerned.

Signal Integrity (SI) refers to the ability of a signal to resist various interferences and maintain its own domain and frequency domain characteristics during transmission. If the received signal waveform and spectrum are generally the same or similar to the transmitted signal, it indicates that the circuit has good signal integrity. However, if the signal cannot respond normally with the required timing and amplitude when it reaches the receiving end, it indicates that the circuit has a signal integrity problem. The main manifestations of signal integrity problems are signal reflection, crosstalk, electromagnetic interference, delay, and jitter.

Insertion loss refers to the signal loss that occurs in a transmission system due to the insertion of components or devices at a certain point. It usually refers to attenuation, and the insertion loss is expressed in decibels (dB) corresponding to the received signal level. Insertion loss mostly refers to power loss, while attenuation refers to the decrease in the amplitude of the signal voltage relative to the original signal amplitude. As shown in Figure 1, the influencing factors of insertion loss are mainly related to the PCB material Dk/Df, the conductor resistance, conductor surface roughness, line width, line spacing, and dielectric thickness, as well as to reflection, dielectric loss, and "skin effect".

The process of the high-speed PCB after material cutting includes inner layer brown film, lamination, exposure, laser drilling, baking, plasma copper, plating, outer layer routing, outer layer etching, solder mask, and electrical milling

Hot Tags: stepped hole on PCB, China stepped hole on PCB manufacturers, suppliers, factory, F4BM radar circuit board Flash gold electroplated gold Gold finger, , Hybrid PCB