Aluminum Nitride( AlN) is currently the best ceramic substrate material accessible. Because of its properties of high thermal conductivity( 170 W/ mK) combined with being a strong dielectric and low expansion( CTE) makes it the material of choice today as a substrate or package for high power LEDs, IC's, sensors and many other components and circuits.

We can supply Aluminum Nitride PCB with either be printed Tin or copper. The choice for one or the other conductor depends on the application, your experience with ceramics, circuit layout, assembly, and cost. Thanks to our experience in the field, we can help you make the right choice for your design.

When copper metallization is used, other PCB components, such as solder, resist, and surface finishes, can be used in a similar manner. However, because silver is made using thick film, only a blue glass solder mask, which is advised for high-temperature designs, is available. We provide hot air solder leveling to protect the exposed pads in high sulfur environments where silver corrosion may be a problem.

The main reasons Alumina is chosen over other printed circuit boards is:

Higher operating temperature up to 350ºC (using thick film printing)

Lower expansion coefficient (6-8 ppm/ºC) matching components

Good thermal properties (22-24 W/mK)

Superior high-frequency performance

Smaller package size due to integration and multi-layer possibilities

High wear and chemical hazards resistance

Hermetic packages possible, 0% water absorption

Good light reflection due to white color.

Limited to no outgassing

Strong rigid material

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