Products

Embedded Copper PCBs
Automotive boards must pass strick testing and quality control procedures in order to meet these particular requirements and uphold industry standards. Embedded copper PCBs come in three different varieties.
"Through-hole copper" is the most common and widely used design, mainly used for general integration and the core functional requirement of heat dissipation. Currently, it is used in 5G communication base stations and data center backplanes. "Blind buried copper" design is generally used for high integration, miniaturization, and low cost requirements.
Key control points:
The slot size of the core board is larger than the copper block by a value of a on each side.
The slot size of the PP is larger than the copper block by a value of b on each side.
The slot on the core board is finished with a special sharp edge process.
The copper block is browned using a special method, and its thickness is larger than the thickness of the laminated board by a certain value.
High alignment accuracy is achieved through special control of pre-stacking, riveting, and hot melt.
Quality control of copper block implantation operation; standard operation for lamination.
The pressing parameters can match the PP process and XM80 overlay.
Multi-segment and multi-brush control is used for ceramic grinding plates.
Suitable grinding brushes are used for rough grinding.
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BSI´s PCB Features |
BSI´s technical spec |
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Number of layers |
4 layers |
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Technology highlights |
Embedded Copper up to 6ounces |
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Materials |
higher performance FR-4-SY |
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Dielectric thickness |
0.4mm |
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Copper weights (finished) |
6 ounces |
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Minimum track and gaps |
0.12mm / 0.12mm |
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core thickness |
1.1mm post bonded |
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Surface finishes available |
HAL-Free |
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